Google Pixel 11 Pro Fold FCC Leak: Google Finally Ditching Exynos?

Photo Credit:FCC / Android Headlines

 

The Google Pixel 11 Pro Fold recently appeared in a Federal Communications Commission (FCC) filing, providing strong evidence that Google is finally moving away from Samsung’s Exynos modems in favor of a MediaTek solution.

Key Details from the FCC Filing

• Model Number: The device in the filing is identified by the model number GZDQ6, which has been tied to the Pixel 11 Pro Fold in previous leaks.

• Modem Transition: The documentation references MediaTek processing algorithms within its radio frequency (RF) testing reports. Since Samsung does not use rival MediaTek algorithms in its proprietary Exynos modems, this is widely viewed as strong evidence that the Tensor G6 chipset will utilize the MediaTek M90 modem, although Google has not officially confirmed the hardware.

• Design Confirmation: The paperwork confirms the device is a foldable, as it details specific radio and volume testing procedures for both "open mode" and "closed mode" user scenarios.

• Connectivity: The filing confirms support for 5G mmWave and sub-6GHz networks, satellite connectivity, NFC, UWB (Ultra-Wideband), and wireless charging.

Why This Matters

For years, Pixel users and reviewers have reported issues with battery drain, thermal throttling, and inconsistent cellular performance, often attributing these problems to the Samsung Exynos modems integrated into previous Tensor generations. If confirmed, the transition to the MediaTek M90 modem could improve power efficiency, network reliability, and connection stability compared with previous Pixel generations.

Photo Credit:FCC / Android Headlines

Launch Information

• Event: Google has officially scheduled its "Made by Google" launch event for August 12, 2026.

• Lineup: The event is expected to feature the Pixel 11, Pixel 11 Pro, Pixel 11 Pro XL, and the Pixel 11 Pro Fold.

• Specifications: Beyond the modem, the Pixel 11 series is rumored to be powered by the new Tensor G6 processor, which is rumored to be manufactured on TSMC's 2nm process node. The foldable is rumored to feature a 6.4-inch cover display and an 8.0-inch inner screen, with potential memory options of 12GB or 16GB of RAM.

Post Source

Source: Based on FCC regulatory filings and reports by Android Authority.

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